Influence on LSI package wireability of via availability and wiring track accessibility

Authors:
J. H. Koch;W. F. Mikhail;W. R. Heller
Affiliations:
IBM General Technology Division laboratory, Hopewell Junction, New York;IBM General Technology Division laboratory, Hopewell Junction, New York;IBM Data Systems Division laboratory, Poughkeepsie, New York
Venue:
IBM Journal of Research and Development
Year:
1982

Citing 7
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Prediction of wiring space requirements for LSI

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On a Pin Versus Block Relationship For Partitions of Logic Graphs

IEEE Transactions on Computers

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Abstract

The introduction of the high performance T2L device technology for the IBM 4300 Systems and the System/38 required extensions of the 24-mm metallized ceramic module used in prior IBM systems. The extension of the metallized ceramic technology ...