IBM eServer z900 I/O subsystem

  • Authors:

  • D. J. Stigliani;T. E. Bubb;D. F. Casper;J. H. Chin;S. G. Glassen;J. M. Hoke;V. A. Minassian;J. H. Quick;C. H. Whitehead

  • Affiliations:

  • IBM Server Group, Poughkeepsie, New York;IBM Server Group, Poughkeepsie, New York;IBM Server Group, Poughkeepsie, New York;IBM Server Group, Poughkeepsie, New York;IBM Server Group, Poughkeepsie, New York;IBM Server Group, Poughkeepsie, New York;IBM Server Group, Poughkeepsie, New York;IBM Server Group, Poughkeepsie, New York;IBM Server Group, Poughkeepsie, New York

  • Venue:
  • IBM Journal of Research and Development
  • Year:
  • 2002

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Abstract

The IBM eServer z900 is the first in a generation of future eServers that continues its leadership via a new I/O subsystem with enhancements in capability, performance, configuration management, and qualities of service. Significant features of the I/O subsystem are included to support the 64-bit z/Architecture™ and configuration-management enhancements [e.g., assignable channel path identifiers (CHPIDs) and dynamic channel path management (DCM)]. A 1GB/s self-timed interface (STI), I/O infrastructure, and I/O card cage are described which support the high-bandwidth I/O (e.g., FICON™, Ethernet). These improvements yield enhanced configuration flexibility and connectivity, as well as reliability, availability, and serviceability (RAS), while providing for future bandwidth growth. The various types of I/O ports supported by the IBM eServer z900 platform are also discussed. A common I/O platform is discussed which has been used to provide a uniform, high-bandwidth attachment of industry-standard peripheral computer interface (PCI) cards, while maintaining the leadership functionality and RAS of the eServer zSeries™. A high-density (16-port) ESCON® I/O card has been designed by exploiting IBM advanced CMOS and state-of-the-art fiber optic technologies. Finally, a high-performance, high-density intersystem channel (ISC-3) coupling link I/O card has been developed for the IBM eServer z900 by leveraging advanced technology and packaging techniques.