What is 3D IC and what are the design challenges for 3D ICs?
ACM SIGDA Newsletter
Analysis and mitigation of lateral thermal blockage effect of through-silicon-via in 3D IC designs
Proceedings of the 17th IEEE/ACM international symposium on Low-power electronics and design
Evaluation of using inductive/capacitive-coupling vertical interconnects in 3D network-on-chip
Proceedings of the International Conference on Computer-Aided Design
Three-dimensional Integrated Circuits: Design, EDA, and Architecture
Foundations and Trends in Electronic Design Automation
Obstacle aware routing in 3d integrated circuits
ADCONS'11 Proceedings of the 2011 international conference on Advanced Computing, Networking and Security
Future memory and interconnect technologies
Proceedings of the Conference on Design, Automation and Test in Europe
ACM Journal on Emerging Technologies in Computing Systems (JETC)
Graceful deadlock-free fault-tolerant routing algorithm for 3D Network-on-Chip architectures
Journal of Parallel and Distributed Computing
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This book provides the reader with a complete understanding of why three dimensional IC design is a promising solution to continue performance scaling, the possible ways to do 3D integration (fabrication), the EDA challenges and solutions to facilitate designers to do 3D IC design, the architectural benefits of using 3D technology, and the design issues at the architecture level. The work covers the background on 3D integration, fabrication options for 3D ICs, EDA flows and algorithms for 3D design, architecture level design techniques for 3D microarchitecture. The book includes an introduction on the background of 3D IC, a motivation that explains why the 3D IC is important and how it will trend, 3D process (fabrication) options, 3D EDA algorithms and tools (physical level and architectural level tools), 3D microarchitecture, including 3D FPGA, 3D single core/multi core processors, 3D Network-onchip designs.