Performance-impact limited area fill synthesis
Proceedings of the 40th annual Design Automation Conference
Physical CAD changes to incorporate design for lithography and manufacturability
Proceedings of the 2004 Asia and South Pacific Design Automation Conference
ISQED '05 Proceedings of the 6th International Symposium on Quality of Electronic Design
CMP aware shuttle mask floorplanning
Proceedings of the 2005 Asia and South Pacific Design Automation Conference
SPIDER: simultaneous post-layout IR-drop and metal density enhancement with redundant fill
ICCAD '05 Proceedings of the 2005 IEEE/ACM International conference on Computer-aided design
Is your layout density verification exact?: a fast exact algorithm for density calculation
Proceedings of the 2007 international symposium on Physical design
Fill for shallow trench isolation CMP
Proceedings of the 2006 IEEE/ACM international conference on Computer-aided design
International Journal of Internet Protocol Technology
Provably good and practically efficient algorithms for CMP dummy fill
Proceedings of the 46th Annual Design Automation Conference
Journal of Intelligent Manufacturing
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Chemical-mechanical polishing (CMP) and other manufacturing steps in very deep submicron very large scale integration have varying effects on device and interconnect features, depending on local characteristics of the layout. To improve manufacturability and performance predictability, the authors seek to make a layout uniform with respect to prescribed density criteria, by inserting "area fill" geometries into the layout. In this paper, they make the following contributions. First, the authors define the flat, hierarchical, and multiple-layer filling problems, along with a unified density model description. Secondly, for the flat filling problem, they summarize current linear programming approaches with two different objectives, i.e., the Min-Var and Min-Fill objectives. They then propose several new Monte Carlo-based filling methods with fast dynamic data structures. Thirdly, they give practical iterated methods for layout density control for CMP uniformity based on linear programming, Monte Carlo, and greedy algorithms. Fourthly, to address the large data volume and inherent lack of scalability of flat layout density control, the authors propose practical methods for hierarchical layout density control. These methods smoothly trade off runtime, solution quality, and output data volume. Finally, they extend the linear programming approaches and present new Monte Carlo-based methods for the multiple-layer filling problem. Comparisons with previous filling methods show the advantages of the new iterated Monte Carlo and iterated greedy methods for both flat and hierarchical layouts and for both density models (spatial density and effective density). The authors achieve near-optimal filling for flat layouts with respect to each of these objectives. Their experiments indicate that the hybrid hierarchical filling approach is efficient, scalable, accurate, and highly competitive with existing methods (e.g., linear programming-based techniques) for hierarchical layouts.