E-BLOW: e-beam lithography overlapping aware stencil planning for MCC system

  • Authors:
  • Bei Yu;Kun Yuan;Jhih-Rong Gao;David Z. Pan

  • Affiliations:
  • Univ. of Texas at Austin, Austin, TX;Cadence Design Systems, Inc., San Jose, CA;Univ. of Texas at Austin, Austin, TX;Univ. of Texas at Austin, Austin, TX

  • Venue:
  • Proceedings of the 50th Annual Design Automation Conference
  • Year:
  • 2013

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Abstract

Electron beam lithography (EBL) is a promising maskless solution for the technology beyond 14nm logic node. To overcome its throughput limitation, recently the traditional EBL system is extended into MCC system. In this paper, we present E-BLOW, a tool to solve the overlapping aware stencil planning (OSP) problems in MCC system. E-BLOW is integrated with several novel speedup techniques, i.e., successive relaxation, dynamic programming and KD-Tree based clustering, to achieve a good performance in terms of runtime and solution quality. Experimental results show that, compared with previous works, E-BLOW demonstrates better performance for both conventional EBL system and MCC system.