Generating Reliable Embedded Processors
IEEE Micro
Shaping interconnect for uniform current density
Proceedings of the 2002 IEEE/ACM international conference on Computer-aided design
17.2 A Design for Testability Study on a High Performance Automatic Gain Control Circuit
VTS '98 Proceedings of the 16th IEEE VLSI Test Symposium
On-Line Techniques for Error Detection and Correction in Processor Registers with Cross-Parity Check
Journal of Electronic Testing: Theory and Applications
Power Grid Planning for Microprocessors and SOCS
ISQED '05 Proceedings of the 6th International Symposium on Quality of Electronic Design
A fast and accurate method for interconnect current calculation
ASP-DAC '03 Proceedings of the 2003 Asia and South Pacific Design Automation Conference
Study of the Effects of SEU-Induced Faults on a Pipeline Protected Microprocessor
IEEE Transactions on Computers
On-line error detection and fast recover techniques for dependable embedded processors
On-line error detection and fast recover techniques for dependable embedded processors
Reliable and adaptive network-on-chip architectures for cyber physical systems
ACM Transactions on Embedded Computing Systems (TECS) - Special section on ESTIMedia'12, LCTES'11, rigorous embedded systems design, and multiprocessor system-on-chip for cyber-physical systems
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Electromigration results from the movement of metal ions as current flows through power wires in integrated circuits, causing voids and hillocks in the wires. The voids increase resistance or even cause opens in the wires, while hillocks can cause shorts to adjacent wires. This paper describes how electromigration is a ticking time bomb in IC designs, which can trigger a system failure at some undefined future time. The phenomenon is particularly likely to afflict the thin, tightly spaced power-distribution lines of deep-submicron designs