Single-layer wire routing and compaction
Single-layer wire routing and compaction
Routability of a rubber-band sketch
DAC '91 Proceedings of the 28th ACM/IEEE Design Automation Conference
A two-dimensional topological compactor with octagonal geometry
DAC '91 Proceedings of the 28th ACM/IEEE Design Automation Conference
SURF: Rubber-Band Routing System for Multichip Modules
IEEE Design & Test
A faster algorithm for rubber-band equivalent transformation for planar VLSI layouts
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Yield modeling and BEOL fundamentals
Proceedings of the 2001 international workshop on System-level interconnect prediction
TROY: track router with yield-driven wire planning
Proceedings of the 44th annual Design Automation Conference
Concurrent wire spreading, widening, and filling
Proceedings of the 44th annual Design Automation Conference
Synergistic physical synthesis for manufacturability and variability in 45nm designs and beyond
Proceedings of the 2008 Asia and South Pacific Design Automation Conference
On old and new routing problems
Proceedings of the 2011 international symposium on Physical design
Wire topology optimization for low power CMOS
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
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This paper presents a unique approach to improve yield given a routed layout. Currently after routing has been completed and compacted, it generally proceeds to verification without further modifications. However, to improve manufacturability, we introduce a concept called even wire distribution, a key element of the SURF physical design tool. To alleviate congestion, we first move vias and wires torwards less dense areas in a manner which preserves the existing wiring paths. Depending on locally available area, we then increase wire spacing to reduce defect sensitivity, without changing the area of the design. Carafe, an inductive fault analysis tool is used to evaluate the new layout.