DAC '98 Proceedings of the 35th annual Design Automation Conference
Layout techniques for minimizing on-chip interconnect self inductance
DAC '98 Proceedings of the 35th annual Design Automation Conference
Dealing with inductance in high-speed chip design
Proceedings of the 36th annual ACM/IEEE Design Automation Conference
On-chip inductance issues in multiconductor systems
Proceedings of the 36th annual ACM/IEEE Design Automation Conference
A twisted-bundle layout structure for minimizing inductive coupling noise
Proceedings of the 2000 IEEE/ACM international conference on Computer-aided design
Inductance Modeling for On-Chip Interconnects
Analog Integrated Circuits and Signal Processing
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With operating frequencies approaching the gigahertz range, inductance is becoming an increasingly important consideration in the design and analysis of on-chip interconnect. We present an accurate technique for modeling and analyzing the effects of parasitic inductance on power grid noise, signal delay and crosstalk. We propose a detailed circuit model composed of interconnect resistance, inductance and distributed capacitance, device decoupling capacitances, quiescent activity in the grid, pad locations, and pad/package inductance which accurately determines current distribution and, hence, on-chip inductive effects, and proves superior to the traditional simplified loop inductance approach. The model uses partial inductances, computed using an analytical formula for a pair of parallel rectangular conductors spaced in any relative position. We present experimental results, obtained from simulations of industrial circuits, that show the importance of various model components while analyzing on-chip inductance.