A fast algorithm for particle simulations
Journal of Computational Physics
FastHenry: a multipole-accelerated 3-D inductance extraction program
DAC '93 Proceedings of the 30th international Design Automation Conference
Stable and efficient reduction of substrate model networks using congruence transforms
ICCAD '95 Proceedings of the 1995 IEEE/ACM international conference on Computer-aided design
Efficient AC and noise analysis of two-tone RF circuits
DAC '96 Proceedings of the 33rd annual Design Automation Conference
Efficient full-wave electromagnetic analysis via model-order reduction of fast integral transforms
DAC '96 Proceedings of the 33rd annual Design Automation Conference
PRIMA: passive reduced-order interconnect macromodeling algorithm
ICCAD '97 Proceedings of the 1997 IEEE/ACM international conference on Computer-aided design
DAC '98 Proceedings of the 35th annual Design Automation Conference
Interconnect parasitic extraction in the digital IC design methodology
ICCAD '99 Proceedings of the 1999 IEEE/ACM international conference on Computer-aided design
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As VLSI circuit speeds have increased, the need for accurate three-dimensional interconnect models has become essential to accurate chip and system design. In this paper, we describe an integral equation approach to modeling the impedance of interconnect structures accounting for both the charge accumulation on the surface of conductors and the current traveling along conductors. Unlike previous methods, our approach is based on a modified nodal analysis formulation and can be used directly to generate guaranteed passive low order interconnect models for efficient inclusion in a standard circuit simulator