A mixed nodal-mesh formulation for efficient extraction and passive reduced-order modeling of 3D interconnects

Authors:
Nuno Marques;Mattan Kamon;Jacob White;L. Miguel Silveira
Affiliations:
INESC/Cadence European Laboratories, Dept. of Elect. and Comp. Eng, Instituto Superior Técnico 1000 Lisboa, Portugal;Research Laboratory of Electronics, Dept. of Elect. Eng. and Comp. Science, Massachusetts Institute of Technology, Cambridge, MA;Research Laboratory of Electronics, Dept. of Elect. Eng. and Comp. Science, Massachusetts Institute of Technology, Cambridge, MA;INESC/Cadence European Laboratories, Dept. of Elect. and Comp. Eng, Instituto Superior Técnico 1000 Lisboa, Portugal
Venue:
DAC '98 Proceedings of the 35th annual Design Automation Conference
Year:
1998

Citing 11
Cited 7

GMRES: a generalized minimal residual algorithm for solving nonsymmetric linear systems

SIAM Journal on Scientific and Statistical Computing
A fast algorithm for particle simulations

Journal of Computational Physics
Efficient reduced-order modeling of frequency-dependent coupling inductances associated with 3-D interconnect structures

DAC '95 Proceedings of the 32nd annual ACM/IEEE Design Automation Conference
Stable and efficient reduction of substrate model networks using congruence transforms

ICCAD '95 Proceedings of the 1995 IEEE/ACM international conference on Computer-aided design
A coordinate-transformed Arnoldi algorithm for generating guaranteed stable reduced-order models of RLC circuits

Proceedings of the 1996 IEEE/ACM international conference on Computer-aided design
Zeros and passivity of Arnoldi-reduced-order models for interconnect networks

DAC '97 Proceedings of the 34th annual Design Automation Conference
PRIMA: passive reduced-order interconnect macromodeling algorithm

ICCAD '97 Proceedings of the 1997 IEEE/ACM international conference on Computer-aided design
A block rational Arnoldi algorithm for multipoint passive model-order reduction of multiport RLC networks

ICCAD '97 Proceedings of the 1997 IEEE/ACM international conference on Computer-aided design
FastPep: a fast parasitic extraction program for complex three-dimensional geometries

ICCAD '97 Proceedings of the 1997 IEEE/ACM international conference on Computer-aided design
An efficient algorithm for fast parasitic extraction and passive order reduction of 3D interconnect models

Proceedings of the conference on Design, automation and test in Europe
Efficient linear circuit analysis by Pade approximation via the Lanczos process

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems

An efficient Lyapunov equation-based approach for generating reduced-order models of interconnect

Proceedings of the 36th annual ACM/IEEE Design Automation Conference
Efficient model reduction of interconnect via approximate system gramians

ICCAD '99 Proceedings of the 1999 IEEE/ACM international conference on Computer-aided design
Guaranteed passive balancing transformations for model order reduction

Proceedings of the 39th annual Design Automation Conference
Proximity templates for modeling of skin and proximity effects on packages and high frequency interconnect

Proceedings of the 2002 IEEE/ACM international conference on Computer-aided design
Poor Man's TBR: A Simple Model Reduction Scheme

Proceedings of the conference on Design, automation and test in Europe - Volume 2
Analysis of full-wave conductor system impedance over substrate using novel integration techniques

Proceedings of the 42nd annual Design Automation Conference
An extension of the generalized Hamiltonian method to S-parameter descriptor systems

Proceedings of the 2010 Asia and South Pacific Design Automation Conference

Quantified Score

Hi-index	0.00

Visualization

Abstract

As VLSI circuit speeds have increased, reliable chip and system design can no longer be performed without accurate three-dimensional interconnect models. In this paper, we describe an integral equation aproach to modeling the impedance of inter-connect structures accounting for both the charge accumulation on the surface of conductors and the current traveling in their interior: Our formulation, based on a combination of nodal and mesh analysis, has the required properties to be combined with Model Order Reduction techniques to generate accurate and guaranteed passive low order Interconnect models for efficient inclusion in standard circuit simulators. Furthermore, the formulation is shown to be more flexible and efficient than previously reported methods.