An interconnect energy model considering coupling effects

  • Authors:
  • Taku Uchino;Jason Cong

  • Affiliations:
  • Toshiba Corporation, 580-1 Horikawa-cho, Saiwai-ku, Kawasaki 212-8520, Japan;Computer Science Department, University of California, Los Angeles, Los Angeles, CA

  • Venue:
  • Proceedings of the 38th annual Design Automation Conference
  • Year:
  • 2001

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Abstract

This paper first presents an analytical interconnect energy model with consideration of event coupling, which is not considered by the conventional $\frac{1}{2}CV^2$ model. Our energy calculation algorithm has the same time complexity as the $\frac{1}{2}CV^2$ model, and is several orders of magnitude faster than {\tt HSPICE} with less than 5% error. In comparison, the error of the $\frac{1}{2}CV^2$ model can be as high as 100%.