Test Challenges in Nanometer Technologies

  • Authors:
  • Sandip Kundu;Sujit T. Zachariah;Sanjay Sengupta;Rajesh Galivanche

  • Affiliations:
  • Intel Corporation, MS: SC12-604, 3600 Julliette Lane, Santa Clara, CA 95054, USA. sandip.kundu@intel.com;Intel Corporation, MS: SC12-604, 3600 Julliette Lane, Santa Clara, CA 95054, USA. sujit.t.zachariah@intel.com;Intel Corporation, MS: SC12-604, 3600 Julliette Lane, Santa Clara, CA 95054, USA. sanjay.sengupta@intel.com;Intel Corporation, MS: SC12-604, 3600 Julliette Lane, Santa Clara, CA 95054, USA. rajesh.galivanche@intel.com

  • Venue:
  • Journal of Electronic Testing: Theory and Applications
  • Year:
  • 2001

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Abstract

Device scaling has led to the blurring of the boundary between design and test: marginalities introduced by design tool approximations can cause failures when aggressive designs are subjected to process variation. Larger die sizes are more vulnerable to intra-die variations, invalidating analyses based on a number of given process corners. These trends are eroding the predictability of test quality based on stuck-at fault coverage. Industry studies have shown that an at-speed functional test with poor stuck-at fault coverage can be a better DPM screen than a set of scan tests with very high stuck-at fault coverage. Contrary to conventional wisdom, we have observed that a high stuck-at fault test set is not necessarily good at detecting faults that model actual failure mechanisms. One approach to address the test quality crisis is to rethink the fault model that is at the core of these tests. Targeting realistic fault models is a challenge that spans the design, test and manufacturing domains: the extraction of realistic faults has to analyze the design at the physical and circuit levels of abstraction while taking into account the failure modes observed during manufacture. Practical fault models need to be defined that adequately model failing behavior while remaining amenable to automatic test generation. The addition of these fault models place increasing performance and capacity demands on already stressed test generation and fault simulation tools. A new generation of analysis and test generation tools is needed to address the challenge of defect-based test. We provide a detailed discussion of process technology trends that are responsible for next generation test problems, and present a test automation infrastructure being developed at Intel to meet the challenge.