A tale of two designs: the cheapest and the most economic
Journal of Electronic Testing: Theory and Applications - Special issue on economics of electronic design, manufacture and test
Design for manufacturability in submicron domain
Proceedings of the 1996 IEEE/ACM international conference on Computer-aided design
Cost and benefit models for logic and memory BIST
DATE '00 Proceedings of the conference on Design, automation and test in Europe
IC design in high-cost nanometer-technologies era
Proceedings of the 38th annual Design Automation Conference
Proceedings of the IEEE International Test Conference
Challenges and directions for testing IC
Integration, the VLSI Journal
Optimization of Test/Diagnosis/Rework Location(s) and Characteristics in Electronic System Assembly
Journal of Electronic Testing: Theory and Applications
Economic analysis of testing homogeneous Manycore chips
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Cost-effective integration of three-dimensional (3D) ICs emphasizing testing cost analysis
Proceedings of the International Conference on Computer-Aided Design
Three-dimensional Integrated Circuits: Design, EDA, and Architecture
Foundations and Trends in Electronic Design Automation
| Hi-index | 0.00 |
Deciding whether and how to use DFT is difficult because the relationship of costs and benefits is far from being well understood. The tradeoff-modeling procedure presented here helps users fill in the missing links in the DFT decision-making process.