Design for manufacturability in submicron domain

Authors:
W. Maly;H. Heineken;J. Khare;P. K. Nag
Affiliations:
Carnegie Mellon University, Electrical and Computer Engineering Dept., Pittsburgh, PA;Carnegie Mellon University, Electrical and Computer Engineering Dept., Pittsburgh, PA;Carnegie Mellon University, Electrical and Computer Engineering Dept., Pittsburgh, PA;Carnegie Mellon University, Electrical and Computer Engineering Dept., Pittsburgh, PA
Venue:
Proceedings of the 1996 IEEE/ACM international conference on Computer-aided design
Year:
1997

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Abstract

Key characteristics of newly emerging IC technologies render the traditional concept of die size minimization and traditional "design rules" insufficient to handle the design-manufacturing interface. This tutorial surveys the design and process characteristics relevant to the manufacturability of submicron ICs. The discussion also covers analysis of design for manufacturability (DFM) trade-offs. Yield and cost models needed to analyze these trade-offs are explained as well.