Challenges and directions for testing IC

Authors:
Liakot Ali;Roslina Sidek;Ishak Aris;Bambang Sunaryo Suparjo;Mohd. Alauddin Mohd. Ali
Affiliations:
Department of Electrical and Electronic Engineering, Universiti Putra Malaysia, Serdang, 43400 Selangor, Malaysia;Department of Electrical and Electronic Engineering, Universiti Putra Malaysia, Serdang, 43400 Selangor, Malaysia;Department of Electrical and Electronic Engineering, Universiti Putra Malaysia, Serdang, 43400 Selangor, Malaysia;Department of Electrical and Electronic Engineering, Universiti Putra Malaysia, Serdang, 43400 Selangor, Malaysia;Department of Electrical, Electronic and Systems Engineering, Universiti Kebangsaan Malaysia, Bangi, Selangor, Malaysia
Venue:
Integration, the VLSI Journal
Year:
2004

Citing 24
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Abstract

In today's semiconductor world, integration technology is improving and refining dramatically. With the continuous increase of integration densities and complexities, the problem of integrated circuit (IC) testing has become much more acute. IC testing is now no more a back-end issue, rather it has become a front-end burning issue, which needs an economic solution with reliable performance. Otherwise all the benefits of semiconductor technology would be meaningless. A roadmap of semiconductor technology in the context of IC testing is shown in this paper. Researchers and manufacturers can get to know current challenges and directions of IC testing through this discussion.