Design and optimization of dual-threshold circuits for low-voltage low-power applications
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
An optimization technique for dual-output domino logic
ISLPED '99 Proceedings of the 1999 international symposium on Low power electronics and design
A static power model for architects
Proceedings of the 33rd annual ACM/IEEE international symposium on Microarchitecture
Threshold Voltage and Power-Supply Tolerance of CMOS Logic Design Families
DFT '00 Proceedings of the 15th IEEE International Symposium on Defect and Fault-Tolerance in VLSI Systems
Intrinsic Leakage in Low-Power Deep Submicron CMOS ICs
Proceedings of the IEEE International Test Conference
Limits to Voltage Scaling from the Low Power Perspective
SBCCI '00 Proceedings of the 13th symposium on Integrated circuits and systems design
Optimal Assignment of High Threshold Voltage for Synthesizing Dual Threshold CMOS Circuits
VLSID '01 Proceedings of the The 14th International Conference on VLSI Design (VLSID '01)
Sub-Domino Logic: Ultra-Low Power Dynamic Sub-Threshold Digital Logic
VLSID '01 Proceedings of the The 14th International Conference on VLSI Design (VLSID '01)
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Low standby power dissipation is the primary need for most of the wireless applications for prolonged battery life. Traditionally ASIC solutions currently address either high density or high performance requirements and to some extent power to cater to the needs of a variety of customers. The solution needs to be improved further for the power considerations specifically. This paper describes how the ASIC solution for high density can be tuned to get a low power library. The strategy involves changing the length of all the mosfets in all the core cells in the library. This solution decreases the leakage power by atleast JX. This paper also describes about the performance and area impact of the low power library compared to the high density library. Unlike the other approaches such as multi Vt. this approach is very cost effective since it neither involves any changes in the fabrication process nor does it require extra masks and hence this is the most suitable and quick solution for the wireless applications.