The Pros and Cons of Very-Low-Voltage Testing: An Analysis based on Resistive Bridging Faults
VTS '04 Proceedings of the 22nd IEEE VLSI Test Symposium
IDDX-based test methods: A survey
ACM Transactions on Design Automation of Electronic Systems (TODAES)
Test generation in the presence of timing exceptions and constraints
Proceedings of the 44th annual Design Automation Conference
System-on-Chip Test Architectures: Nanometer Design for Testability
System-on-Chip Test Architectures: Nanometer Design for Testability
Statistical defect-detection analysis of test sets using readily-available tester data
Proceedings of the International Conference on Computer-Aided Design
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In sub-micron processes, resistive path defectsare increasingly contributing to the yield loss and thecustomer fail pareto. Data has been collected on a seriesof ASIC products and compares the effectiveness of fullvector set transition delay fault tests with reduced vectorsets, minVDD, customer functional tests and customerssystem fails. Results show that fault models do not predictthe defect coverage well and cost effective screening offrequency outliers and minVDD outliers is possible and iscritical in improving customer quality.