Wire segmenting for improved buffer insertion
DAC '97 Proceedings of the 34th annual Design Automation Conference
Three dimensional metallization for vertically integrated circuits
Microelectronic Engineering
3D CMOS SOL for high performance computing
ISLPED '98 Proceedings of the 1998 international symposium on Low power electronics and design
Multiple Si layer ICs: motivation, performance analysis, and design implications
Proceedings of the 37th Annual Design Automation Conference
Stochastic wire-length and delay distributions of 3-dimensional circuits
Proceedings of the 2000 IEEE/ACM international conference on Computer-aided design
Vertically integrated SOI circuits for low-power and high-performance applications
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
Power consumption and performance analysis of 3D NoCs
ACSAC'07 Proceedings of the 12th Asia-Pacific conference on Advances in Computer Systems Architecture
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3-D technology promises higher integration density and lower interconnection complexity and delay. At present, however, not much work on circuit applications has been done due to lack of insight into 3-D circuit architecture and performance. One of the purposes of realizing 3-D integration is to reduce the interconnect complexity and delay of 2-D, which are widely avowed as the barriers to the continued performance gain in the future technology generations. Therefore, in this paper, we present a stochastic 3-D interconnect model, study the impact of 3-D integration on circuit performance and power consumption. We show that 3-D structures effectively reduce the number of long delay nets, significantly reduce the number of repeaters, and dramatically improve the circuit performance. With 3-D integration, circuits can be clocked at frequencies much higher (double, even triple) than with 2-D. However, we also show that the impacts of vertical wires on chip area and interconnect delay can be limiting factors on the vertical integration of device layers; and that 3-D integration offers limited relief of power consumption.