Three dimensional metallization for vertically integrated circuits

Multiple Si layer ICs: motivation, performance analysis, and design implications

Proceedings of the 37th Annual Design Automation Conference

Wiring requirement and three-dimensional integration of field-programmable gate arrays

Proceedings of the 2001 international workshop on System-level interconnect prediction

The next chip challenge: effective methods for viable mixed technology SoCs

Proceedings of the 39th annual Design Automation Conference

Stochastic wire-length and delay distributions of 3-dimensional circuits

Proceedings of the 2000 IEEE/ACM international conference on Computer-aided design

Wiring requirement and three-dimensional integration technology for field programmable gate arrays

IEEE Transactions on Very Large Scale Integration (VLSI) Systems - Special section on system-level interconnect prediction (SLIP)

An Upper Bound for 3D Slicing Floorplans

ASP-DAC '02 Proceedings of the 2002 Asia and South Pacific Design Automation Conference

Power Trends and Performance Characterization of 3-Dimensional Integration for Future Technology Generations

ISQED '01 Proceedings of the 2nd International Symposium on Quality Electronic Design