Wiring requirement and three-dimensional integration of field-programmable gate arrays

  • Authors:
  • Arifur Rahman;Shamik Das;Anantha Chandraksan;Rafael Reif

  • Affiliations:
  • Agere Systems, Allentown, PA;MIT, Cambridge, MA;MIT, Cambridge, MA;MIT, Cambridge, MA

  • Venue:
  • Proceedings of the 2001 international workshop on System-level interconnect prediction
  • Year:
  • 2001

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Abstract

In this paper analytical models for predicting interconnect require冒ments in field-programmable gate arrays (FPGAs) are presented, and opportunities for 3-D implementation of FPGAs are examined. The analytical models for 2-D FPGAs are calibrated by routing and placement experiments with benchmark circuits and extended to 3-D FPGAs. Based on system-level modeling, we find that in FPGAs with 20K 4-input look-up tables, the reduction in channel width, interconnect delay, and power dissipation can be over 50% by 3-D implementation.