Analysis of Noise Avoidance Techniques in DSM Interconnects Using a Complete Crosstalk Noise Model

  • Authors:
  • M. Becer;V. Zolotov;D. Blaauw;R. Panda;I. Hajj

  • Affiliations:
  • Advanced Tools Group, Motorola Inc. Austin, TX;Advanced Tools Group, Motorola Inc. Austin, TX;EECS Dept., University of Michigan, Ann Arbor ;Advanced Tools Group, Motorola Inc. Austin, TX;CSL, University of Illinois at Urbana-Champaign

  • Venue:
  • Proceedings of the conference on Design, automation and test in Europe
  • Year:
  • 2002

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Abstract

Noise estimation and avoidance are becoming critical,must have' capabilities in today's high performance IC design.An accurate yet efficient crosstalk noise model whichcontains as many driver/interconnect parameters as possible,is neccesary for any sensitivity based noise avoidanceapproach. In this paper, we present a complete analyticalcrosstalk noise model which incorporates all physical propertiesincluding victim and aggressor drivers, distributed RCcharacteristics of interconnects and coupling locations inboth victim and aggressor lines. We present closed-form analyticalexpressions for peak noise and noise width as wellas sensitivities to all model parameters. We then use thesemodel parameter sensitivities to analyze and evaluate variousnoise avoidance techniques such as driver sizing, wiresizing, wire spacing and layer assignment. Both our modeland noise avoidance evaluations are verified using realisticcircuits in 0:13µ technology. We also present effectiveness ofdiscussed noise avoidance techniques on a high performancemicroprocessor core.