IEEE Spectrum
End-to-End Test Strategy for Wireless Systems
Proceedings of the IEEE International Test Conference on Driving Down the Cost of Test
Architecting Millisecond Test Solutions for Wireless Phone RFIC's
ITC '02 Proceedings of the 2002 IEEE International Test Conference
A Signature Test Framework for Rapid Production Testing of RF Circuits
Proceedings of the conference on Design, automation and test in Europe
IEEE Communications Magazine
A low-cost test solution for wireless phone RFICs
IEEE Communications Magazine
Structural RFIC device testing through built-in thermal monitoring
IEEE Communications Magazine
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The boundary-scan test provides a structural testsolution for the densely packed digital electronics. For RFdevices, the structural test also provides a gooddiagnostic resolution to the structural defects of RFcircuits, especially for the high pin-count RF-SOCs. Inthis paper, the boundary-scan test is implemented on a 5-GHz RF pin using LC isolation networks to connect the RF lines and the boundary-scan cell, which isolates theRF circuitry from the digital boundary scan cell. Thistechnique overcomes the parasitic loading problems andprovides a minimum RF performance degradation to aRFIC. The measurement results show only 0.4-dB gaindegradation in a 5-GHz amplifier with a boundary-scancell and LC isolation networks.