A Signature Test Framework for Rapid Production Testing of RF Circuits

  • Authors:
  • R. Voorakaranam;S. Cherubal;A. Chatterjee

  • Affiliations:
  • Ardext Technologies, Atlanta, GA;Ardext Technologies, Atlanta, GA;Ardext Technologies, Atlanta, GA

  • Venue:
  • Proceedings of the conference on Design, automation and test in Europe
  • Year:
  • 2002

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Abstract

Production test costs for today's RF circuits arerapidly escalating. Two factors are responsible for thiscost escalation: (a) the high cost of RF ATEs and(b) long test times required by elaborate performancetests. In this paper, we propose a framework for low-cost signature test of RF circuits using modulation ofa baseband test signal and subsequent demodulation ofthe DUT response. The demodulated response of theDUT is used as a "signature" from which all the performance specifications are predicted. The applied testsignal is optimized in such a way that the error between the measured DUT performances and the predicted DUT performances is minimized. The proposedlow-cost solution can be easily built into a load boardthat can be interfaced to an inexpensive tester.