Proceedings of the 2006 IEEE/ACM international conference on Computer-aided design
Latch Susceptibility to Transient Faults and New Hardening Approach
IEEE Transactions on Computers
Circuit and Latch Capable of Masking Soft Errors with Schmitt Trigger
Journal of Electronic Testing: Theory and Applications
Guiding circuit level fault-tolerance design with statistical methods
Proceedings of the conference on Design, automation and test in Europe
Soft Error Rate Reduction Using Circuit Optimization and Transient Filter Insertion
Journal of Electronic Testing: Theory and Applications
Accurate linear model for SET critical charge estimation
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
A 11-transistor nanoscale CMOS memory cell for hardening to soft errors
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
Soft error-aware power optimization using gate sizing
PATMOS'07 Proceedings of the 17th international conference on Integrated Circuit and System Design: power and timing modeling, optimization and simulation
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In this paper we present a detailed analysis on how the critical charge (Q_crit) of a circuit node, usually employed to evaluate the probability of transient fault (TF) occurrence as a consequence of a particle hit, depends on transistorsý sizing. We derive an analytical model allowing us to calculate a nodeýs Q_crit given the size of the nodeýs driving gate and fan-out gate(s), thus avoiding time costly electrical level simulations. We verified that such a model features an accuracy of the 97% with respect to electrical level simulations performed by HSPICE. Our proposed model shows that Q_crit depends much more on the strength (conductance) of the gate driving the node, than on the node total capacitance. We also evaluated the impact of increasing the conductance of the driving gate on TFsý propagation, hence on Soft Error Susceptibility (SES).We found that such a conductance increase not only improves the TF robustness of the hardened node, but also that of the whole circuit.