Burn-in Elimination of a High Volume Microprocessor Using IDDQ
Proceedings of the IEEE International Test Conference on Test and Design Validity
CMOS IC reliability indicators and burn-in economics
ITC '98 Proceedings of the 1998 IEEE International Test Conference
The Effectiveness of IDDQ and High Voltage Stress for Burn-in Elimination
IDDQ '96 Proceedings of the 1996 IEEE International Workshop on IDDQ Testing (IDDQ '96)
Test scheduling for wafer-level test-during-burn-in of core-based SoCs
Proceedings of the conference on Design, automation and test in Europe
Power management using test-pattern ordering for wafer-level test during burn-in
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
Economic analysis of testing homogeneous Manycore chips
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
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Editor's note: High-voltage stress testing (HVST) is common in IC manufacturing, but publications comparing it with other test and burn-in methods are scarce. This article shows that the use of HVST can dramatically reduce the amount of required burn-in.--Phil Nigh, IBM Microelectronics