Computer architecture (2nd ed.): a quantitative approach
Computer architecture (2nd ed.): a quantitative approach
Multilevel hypergraph partitioning: applications in VLSI domain
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
VISI Physical Design Automation: Theory and Practice
VISI Physical Design Automation: Theory and Practice
SMARTS: accelerating microarchitecture simulation via rigorous statistical sampling
Proceedings of the 30th annual international symposium on Computer architecture
Fast flip-chip power grid analysis via locality and grid shells
Proceedings of the 2004 IEEE/ACM International conference on Computer-aided design
Proceedings of the 2006 international symposium on Low power electronics and design
Fixed-outline floorplanning: enabling hierarchical design
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
Congestion-aware power grid optimization for 3D circuits using MIM and CMOS decoupling capacitors
Proceedings of the 2009 Asia and South Pacific Design Automation Conference
Proceedings of the 21st edition of the great lakes symposium on Great lakes symposium on VLSI
Power delivery design for 3-D ICs using different through-silicon via (TSV) technologies
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
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This paper addresses the module assignment problem in pin-limited designs under the stacked-Vdd circuit paradigm. A partition-based algorithm is presented for efficiently assigning modules at the floorplanning level so as to reuse currents between the Vdd domains, and minimize the power wasted during the operation of the circuit. Experimental results on a DLX architecture show that compared with assigning modules to different Vdd rails using a bin-packing technique, the circuit generated by our algorithm has 32% lower wasted power, on average. In addition, experiments on a 3D IC example show that our module assignment approach is equally effective in reducing the power waste in 3D ICs.