DX-compactor: distributed X-compaction for SoCs

  • Authors:
  • Reshma C. Jumani;Niraj Bharatkumar Jain;Virendra Singh;Kewal K. Saluja

  • Affiliations:
  • Indian Institute of Science, Bangalore, India;Indian Institute of Science, Bangalore, India;Indian Institute of Science, Bangalore, India;University of Wisconsin-Madison, Madison, WI, USA

  • Venue:
  • Proceedings of the 19th ACM Great Lakes symposium on VLSI
  • Year:
  • 2009

Quantified Score

Hi-index 0.00

Visualization

Abstract

The emergence of System-on-Chip (SoC) devices has led to a complex on-chip interconnect structure that consumes significant area. Distributed compaction is a test response compaction scheme for an SoC that aims at reducing the area occupied for the purpose of testing the chip. This technique involves the design of compactors for individual cores on the chip. These are interconnected suitably to achieve the required functionality while reducing the area overhead by decreasing the length and the number of interconnects that are routed from scan chain outputs to the output pins. The distributed compaction technique matches the performance of an X-Compactor in terms of error detection and X-masking.