Energy/area/delay tradeoffs in the physical design of on-chip segmented bus architecture

  • Authors:
  • Jin Guo;Antonis Papanikolaou;Hao Zhang;Francky Catthoor

  • Affiliations:
  • IMEC, Leuven, Belgium and Katholieke Universiteit Leuven, Leuven, Belgium;IMEC, Leuven, Belgium;IMEC, Leuven, Belgium;IMEC, Leuven, Belgium and Katholieke Universiteit Leuven, Leuven, Belgium

  • Venue:
  • IEEE Transactions on Very Large Scale Integration (VLSI) Systems
  • Year:
  • 2007

Quantified Score

Hi-index 0.00

Visualization

Abstract

The increasing gap between design productivity and chip complexity and the emerging systems-on-chip (SoCs) architectural template have led to the wide utilization of reusable hard intellectual property (IP) cores. Macro block-based physical design implementation needs to find a well-balanced solution among chip area, on-chip communication energy, and critical communication path delay. We present in this paper an automated way to implement an energy optimal netlist interconnecting the hard macro blocks using a heavily segmented communication architecture. We explore the entire tradeoff curve among the network energy, chip area, and critical communication path delay at the floorplanning stage based on two real-life application drivers. Large energy gains with small area overheads are illustrated during the floorplanning stage. This tradeoff profile is a good guideline for the SOC designers to choose the optimal solution for their specific systems.