Test-wrapper optimization for embedded cores in TSV-based three-dimensional SOCs

Authors:
Brandon Noia;Krishnendu Chakrabarty;Yuan Xie
Affiliations:
Department of Electrical and Computer Engineering, Duke University, Durham, NC;Department of Electrical and Computer Engineering, Duke University, Durham, NC;Department of Computer Science and Engineering, Pennsylvania State University, University Park, PA
Venue:
ICCD'09 Proceedings of the 2009 IEEE international conference on Computer design
Year:
2009

Citing 13
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Abstract

System-on-chip (SOC) designs comprised of a number of embedded cores are widespread in today's integrated circuits. Embedded core-based design is likely to be equally popular for three-dimensional integrated circuits (3D ICs), the manufacture of which has become feasible in recent years. 3D integration offers a number of advantages over traditional two-dimensional (2D) technologies, such as the reduction in the average interconnect length, higher performance, lower interconnect power consumption, and smaller IC footprint. Despite recent advances in 3D fabrication and design methods, no attempt has been made thus far to design a 1500-style test wrapper for an embedded core that spans multiple layers in a 3D SOC. This paper addresses wrapper optimization in 3D ICs based on through-silicon vias (TSVs) for vertical interconnects. Our objective is to minimize the scan-test time for a core under constraints on the total number of TSVs available for testing. We present two polynomial-time heuristic solutions. Simulation results are presented for embedded cores from the ITC 2002 SOC test benchmarks.