Evolutionary Algorithms for Solving Multi-Objective Problems
Evolutionary Algorithms for Solving Multi-Objective Problems
Design Challenges of Technology Scaling
IEEE Micro
Thermal-Aware Floorplanning Using Genetic Algorithms
ISQED '05 Proceedings of the 6th International Symposium on Quality of Electronic Design
Accurate temperature-dependent integrated circuit leakage power estimation is easy
Proceedings of the conference on Design, automation and test in Europe
Statistical power profile correlation for realistic thermal estimation
Proceedings of the 2008 Asia and South Pacific Design Automation Conference
Temperature Aware Floorplanning via Geometry Programming
CSEWORKSHOPS '08 Proceedings of the 2008 11th IEEE International Conference on Computational Science and Engineering - Workshops
A novel thermal optimization flow using incremental floorplanning for 3D ICs
Proceedings of the 2009 Asia and South Pacific Design Automation Conference
ParMiBench - An Open-Source Benchmark for Embedded Multiprocessor Systems
IEEE Computer Architecture Letters
Fixed-outline floorplanning: enabling hierarchical design
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
3D Thermal-aware floorplanner for many-core single-chip systems
LATW '11 Proceedings of the 2011 12th Latin American Test Workshop
A fast and elitist multiobjective genetic algorithm: NSGA-II
IEEE Transactions on Evolutionary Computation
A Memetic Algorithm for VLSI Floorplanning
IEEE Transactions on Systems, Man, and Cybernetics, Part B: Cybernetics
A matrix synthesis approach to thermal placement
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Multiobjective Microarchitectural Floorplanning for 2-D and 3-D ICs
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
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3D integration has become one of the most promising techniques for the integration future multi-core processors, since it improves performance and reduces power consumption by decreasing global wire length. However, 3D integration causes serious thermal problems since the closer proximity of heat generating dies makes existing thermal hotspots more severe. Thermal-aware floorplanners can play an important role to improve the thermal profile, but they have failed in considering the dynamic power profiles of the applications. This paper proposes a novel thermal-aware floorplanner guided by the power profiling of a set of benchmarks that are representative of the application scope. The results show how our approach outperforms the thermal metrics as compared with the worst-case scenario usually considered in "traditional" thermal-aware floorplanners.