Reliability, thermal, and power modeling and optimization

  • Authors:
  • Robert P. Dick

  • Affiliations:
  • University of Michigan, Ann Arbor, Michigan

  • Venue:
  • Proceedings of the International Conference on Computer-Aided Design
  • Year:
  • 2010

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Abstract

This tutorial provides an overview of challenges to designing and implementing reliable integrated circuits and systems, and suggests areas for future study. It illustrates some concepts in detail, explaining the challenges of appropriately considering the impact of temperature on reliability in fault-tolerant systems. Finally, it points out considerations that may influence adoption of reliability modeling and optimization techniques and stresses the importance of considering the most relevant fault processes during reliability modeling and optimization.