Multi-pad power/ground network design for uniform distribution of ground bounce
DAC '98 Proceedings of the 35th annual Design Automation Conference
Hierarchical analysis of power distribution networks
Proceedings of the 37th Annual Design Automation Conference
Optimal placement of power supply pads and pins
Proceedings of the 41st annual Design Automation Conference
A fast algorithm for power grid design
Proceedings of the 2005 international symposium on Physical design
Fast flip-chip power grid analysis via locality and grid shells
Proceedings of the 2004 IEEE/ACM International conference on Computer-aided design
Proceedings of the 2005 Asia and South Pacific Design Automation Conference
Fast Placement Optimization of Power Supply Pads
ASP-DAC '07 Proceedings of the 2007 Asia and South Pacific Design Automation Conference
Hotspot: acompact thermal modeling methodology for early-stage VLSI design
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
A multigrid-like technique for power grid analysis
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
On-chip power-supply network optimization using multigrid-based technique
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Parallel On-Chip Power Distribution Network Analysis on Multi-Core-Multi-GPU Platforms
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
Optimization of on-chip switched-capacitor DC-DC converters for high-performance applications
Proceedings of the International Conference on Computer-Aided Design
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This paper presents an efficient algorithm for the placement of power supply pads in flip-chip packaging for high-performance VLSI circuits. The placement problem is formulated as a mixed-integer linear program (MILP), subject to the constraints on mean-time-to-failure (MTTF) for the pads and the voltage drop in the power grid. To improve the performance of the optimizer, the pad placement problem is solved based on the divide-and-conquer principle, and the locality properties of the power grid are exploited by modeling the distant nodes and sources coarsely, following the coarsening stage in multigrid-like approach. An accurate electromigration (EM) model that captures current crowding and Joule heating effects is developed and integrated with our C4 placement approach. The effectiveness of the proposed approach is demonstrated on several designs adapted from publicly released benchmarks.