Multi-GHz interconnect effects in microprocessors

  • Authors:
  • Phillip J. Restle;Albert E. Ruehli;Steven G. Walker

  • Affiliations:
  • IBM T. J. Watson Research Center, P.O. Box 218, Yorktown Heights, NY;IBM T. J. Watson Research Center, P.O. Box 218, Yorktown Heights, NY;IBM T. J. Watson Research Center, P.O. Box 218, Yorktown Heights, NY

  • Venue:
  • Proceedings of the 2001 international symposium on Physical design
  • Year:
  • 2001

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Abstract

High frequency on-chip interconnect examples are accurately analyzed using full-wave PEEC (Partial Element Equivalent Circuit) analysis. All wire currents and voltages (or delays) are visualized using 3D animations to aid intuitive understanding of new, high frequency interconnect effects.