A fast hierarchical algorithm for 3-D capacitance extraction
DAC '98 Proceedings of the 35th annual Design Automation Conference
IC analyses including extracted inductance models
Proceedings of the 36th annual ACM/IEEE Design Automation Conference
Inductance 101: analysis and design issues
Proceedings of the 38th annual Design Automation Conference
Simulation approaches for strongly coupled interconnect systems
Proceedings of the 2001 IEEE/ACM international conference on Computer-aided design
A local circuit topology for inductive parasitics
Proceedings of the 2002 IEEE/ACM international conference on Computer-aided design
CHIME: coupled hierarchical inductance model evaluation
Proceedings of the 41st annual Design Automation Conference
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
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The increasing size of integrated systems combined with deep submicron physical modeling details creates an explosion in RLC interconnect modeling complexity of unmanageable proportions. Interconnect extraction tools employ hierarchy to manage complexity, but this hierarchy is discarded via eliminating far away coupling terms when the equivalent RLC circuits are formed. The increasing dominance of capacitance coupling along with the emergence of on-chip inductance, however, makes the composite effect of far-away couplings increasingly evident. Even if newly enforced design rules and practices will ultimately obviate the need for modeling these couplings for design verification, some approximation of the "exact" solution is required to validate these rules. This paper proposes an efficient hierarchical equivalent circuit representation of interconnect parasitics that utilizes the efficient hierarchical long-distance modeling already existing within extractors. Results from a prototype simulator based on these hierarchical models demonstrates the simulation inaccuracy incurred when the far-away coupling terms are ignored. Such a form of interconnect modeling may provide the key to hierarchical modeling of electro-magnetic interactions between large components on future gigascale systems.