Detection of Temperature Sensitive Defects Using ZTC
VTS '04 Proceedings of the 22nd IEEE VLSI Test Symposium
IDDX-based test methods: A survey
ACM Transactions on Design Automation of Electronic Systems (TODAES)
Ramp Voltage Testing for Detecting Interconnect Open Faults
IEICE - Transactions on Information and Systems
System-on-Chip Test Architectures: Nanometer Design for Testability
System-on-Chip Test Architectures: Nanometer Design for Testability
Layout-based defect-driven diagnosis for intracell bridging defects
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
On-Chip Delay Measurement Based Response Analysis for Timing Characterization
Journal of Electronic Testing: Theory and Applications
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Defect-based test studies have thoroughly characterized CMOS IC hard bridge and open defects while less is known about a third class called parametric failures. These are more difficult to detect, and their presence is growing in CMOS IC nanoelectronics. The objective of this work is to present data that encompass the electronic properties of parametric failures that affect our ability to test present and future CMOS ICs. While parametric failures are widely reported, we seek to classify these failures with supporting data. Solutions to this complex test problem require that we structure and formalize their behaviors. Data indicate that multi-parameter test strategies have the best match to some of the failures while good test strategies do not exist for others.