Logical Design of Digital Systems
Logical Design of Digital Systems
A logic design structure for LSI testability
DAC '77 Proceedings of the 14th Design Automation Conference
Built-in Testing of Integrated Circuit Wafers
Built-in Testing of Integrated Circuit Wafers
The consensus problem in fault-tolerant computing
ACM Computing Surveys (CSUR)
A Diagnosis Algorithm for Constant Degree Structures and Its Application to VLSI Circuit Testing
IEEE Transactions on Parallel and Distributed Systems
Hierarchical Diagnosis of Identical Units in a System
IEEE Transactions on Computers
Boundary Scan-Based Relay Wave Propagation Test of Arrays of Identical Structures
IEEE Transactions on Computers
Correct and Almost Complete Diagnosis of Processor Grids
IEEE Transactions on Computers
Almost Sure Diagnosis of Almost Every Good Element
IEEE Transactions on Computers
Adaptive Unanimous Voting (UV) Scheme for Distributed Self-Diagnosis
IEEE Transactions on Computers
Evaluation of a Diagnosis Algorithm for Regular Structures
IEEE Transactions on Computers
Fault-diagnosis of grid structures
Theoretical Computer Science - Dependable computing
Diagnostic Model and Diagnosis Algorithm of a SIMD Computer
EDCC-3 Proceedings of the Third European Dependable Computing Conference on Dependable Computing
Diagnosability of regular systems
Journal of Algorithms
Utilizing spares in multichip modules for the dual function of fault coverage and fault diagnosis
DFT '95 Proceedings of the IEEE International Workshop on Defect and Fault Tolerance in VLSI Systems
Worst-Case Diagnosis Completeness in Regular Graphs under the PMC Model
IEEE Transactions on Computers
Probabilistic diagnosis of clustered faults for shared structures
Mathematical and Computer Modelling: An International Journal
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Production testing of a digital circuit requires the generation of a sequence of tests and their application to the circuit being tested. Currently, in test application, the output of the circuit under test is compared to a known correct output for each test. The method has some drawbacks likely to become more critical in the near future. In homogeneous systems of identical integrated circuits of silicon wafers, testing can be done in another way, i.e. by applying a common test to several processing elements at once and comparing the results produced by them. The authors analyze such schemes and show that they are inherently as accurate as current methods that use assumed correct results for production testing. Since this approach could allow wafers to be tested for production faults significantly more quickly than by using a probe tester, the results indicate that it can provide an attractive alternative to current methods for production testing of silicon wafers.