Multiple Transition Model and Enhanced Boundary Scan Architecture to Test Interconnects for Signal Integrity

  • Authors:
  • M. H. Tehranipour;N. Ahmed;M. Nourani

  • Affiliations:
  • -;-;-

  • Venue:
  • ICCD '03 Proceedings of the 21st International Conference on Computer Design
  • Year:
  • 2003

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Abstract

As the technology is shrinking toward 50 nm and the workingfrequency is going into multi gigahertz range, the effect ofinterconnectson functionality and performance of system-on-chips isbecoming dominant. More specifically, distortion (integrity loss)of signals traveling on high-speed interconnects can no longer beignored. In this paper, we propose a new fault model, calledmultiple transition, and its corresponding test pattern generationmechanism. We also extend the conventional boundary scanarchitecture to allow testing signal integrity in SoCinterconnects. Our extended JTAG architecture collects and outputsthe integrity loss information using the enhanced observationcells. The architecture fully complies with the JTAG standard andcan be adopted by any SoC that is IEEE 1149.1 compliant.