RF microelectronics
Wireless integrated network sensors
Communications of the ACM
A phase noise spectrum test solution for high volume mixed signal/wireless automatic test equipments
Proceedings of the IEEE International Test Conference 2001
IEEE Communications Magazine
On-Chip Testing Techniques for RF Wireless Transceivers
IEEE Design & Test
Interactive presentation: Boosting SER test for RF transceivers by simple DSP technique
Proceedings of the conference on Design, automation and test in Europe
Go/No-Go testing of VCO modulation RF transceivers through the delayed-RF setup
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
Detailed characterization of transceiver parameters through loop-back-based BiST
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
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Traditionally, radio frequency (RF) paths are bypassedduring wafer sort due to the high cost of RF testing. Increasingpackaging costs, however, result in a need for amore thorough wafer-level testing including the RF path.In this paper, we propose a loop-back architecture, alongwith a novel, all-digital design-for-testability (DfT) modificationthat enables cost efficient testing of various defectsat the wafer level. These methods are applicable to a widerange of cost-sensitive applications that use the modulationof the voltage-controlled-oscillator (VCO). Experimentalresults using a Bluetooth platform and considering a varietyof defects confirm the viability of the approach.