Process equipment modeling: application of cluster tool modeling to a 300 mm fab simulation

Authors:
Sameer T. Shikalgar;David Fronckowiak;Edward A. MacNair
Affiliations:
IBM Microelectronics Division, East Fishkill, NY;IBM Microelectronics Division, East Fishkill, NY;IBM T. J. Watson Research Center, Yorktown Heights, NY
Venue:
Proceedings of the 35th conference on Winter simulation: driving innovation
Year:
2003

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Abstract

300 mm semiconductor wafer fabrication facilities, like conventional semiconductor fabs, contain many different types of tools. In this paper we discuss a realistic way of representing cluster tools in a simulation model of the entire line. A more realistic representation of cluster tools results in greater accuracy in the output of the simulation model.