Low-power design methodology for an on-chip bus with adaptive bandwidth capability
Proceedings of the 40th annual Design Automation Conference
Current Sensing Techniques for Global Interconnects in Very Deep Submicron(VDSM) CMOS
WVLSI '01 Proceedings of the IEEE Computer Society Workshop on VLSI 2001
Current-mode signaling in deep submicrometer global interconnects
IEEE Transactions on Very Large Scale Integration (VLSI) Systems - Special section on the 2001 international conference on computer design (ICCD)
Voltage-mode driver preemphasis technique for on-chip global buses
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
SSMCB: low-power variation-tolerant source-synchronous multicycle bus
IEEE Transactions on Circuits and Systems Part I: Regular Papers
On signalling over through-silicon via (TSV) interconnects in 3-D integrated circuits
Proceedings of the Conference on Design, Automation and Test in Europe
Robust signaling techniques for through silicon via bundles
Proceedings of the 21st edition of the great lakes symposium on Great lakes symposium on VLSI
Quasi-resonant interconnects: a low power, low latency design methodology
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
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This brief describes an adaptive bandwidth bus architecture based on hybrid current/voltage mode repeaters for long global RC interconnect static busses that achieves high-data rates while minimizing the static power dissipation associated with current-mode (CM) signaling. An experimental adaptive bandwidth bus test chip fabricated in AMI 1.6-µm Bulk CMOS indicates a reduction in power dissipation of approximately 62% over CM sensing and an increase in maximum data rate of 40% over voltage-mode signaling.