Performance-impact limited area fill synthesis
Proceedings of the 40th annual Design Automation Conference
Impact of Interconnect Pattern Density Information on a 90nm Technology ASIC Design Flow
ISQED '03 Proceedings of the 4th International Symposium on Quality Electronic Design
ISQED '03 Proceedings of the 4th International Symposium on Quality Electronic Design
Filling algorithms and analyses for layout density control
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Study of Floating Fill Impact on Interconnect Capacitance
ISQED '06 Proceedings of the 7th International Symposium on Quality Electronic Design
Novel wire density driven full-chip routing for CMP variation control
Proceedings of the 2007 IEEE/ACM international conference on Computer-aided design
Proceedings of the 18th ACM Great Lakes symposium on VLSI
Metal filling impact on standard cells: definition of the metal fill corner concept
Proceedings of the 21st annual symposium on Integrated circuits and system design
A novel wire-density-driven full-chip routing system for CMP variation control
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
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In recent system-on-chip (SoC) designs, floating dummy metals inserted for planarization have created serious problems because of increased interconnect capacitance and the enormous amount of fill required. We present new methods to reduce the interconnect capacitance and the amount of dummy metals needed. These techniques include three ways of filling: 1) improved floating square fills, 2) floating parallel lines, and 3) floating perpendicular lines (with spacing between dummy metals above and below signal lines). We also present efficient simple formulas for estimating the appropriate spacing and number of fills. In our experiments, the capacitance increase using the traditional regular square method was 13.1%, while that using the methods of improved square fills, extended parallel lines, and perpendicular lines was 2.5%, 2.4%, and 1.1%, respectively. Moreover, the number of necessary dummy metals can be reduced by two orders of magnitude through use of the parallel line method.