Statistical modeling of cross-coupling effects in VLSI interconnects

Authors:
Mridul Agarwal;Kanak Agarwal;Dennis Sylvester;David Blaauw
Affiliations:
Indian Institute of Technology, Kanpur;University of Michigan, Ann Arbor;University of Michigan, Ann Arbor;University of Michigan, Ann Arbor
Venue:
Proceedings of the 2005 Asia and South Pacific Design Automation Conference
Year:
2005

Citing 12
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Abstract

In this paper, we develop an approach for statistical modeling of crosstalk noise and dynamic delay degradation in coupled RC interconnects under process variations. The proposed model enables closed-form computation of mean and variance of noise peak and worst case dynamic delay for given variabilities in physical dimensions. We compare the proposed model against HSPICE Monte Carlo simulations and report an average error in mean and standard deviation of noise peak to be 2.7% and 3.7% respectively.