DSP'09 Proceedings of the 16th international conference on Digital Signal Processing
Electrical modeling and characterization of through-silicon vias (TSVs) for 3-D integrated circuits
Microelectronics Journal
3D stacked power distribution considering substrate coupling
ICCD'09 Proceedings of the 2009 IEEE international conference on Computer design
Interstratum connection design considerations for cost-effective 3-D system integration
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
Cost-driven 3D integration with interconnect layers
Proceedings of the 47th Design Automation Conference
On signalling over through-silicon via (TSV) interconnects in 3-D integrated circuits
Proceedings of the Conference on Design, Automation and Test in Europe
System-level power/performance evaluation of 3D stacked DRAMs for mobile applications
Proceedings of the Conference on Design, Automation and Test in Europe
Power delivery design for 3-D ICs using different through-silicon via (TSV) technologies
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
Evaluation of using inductive/capacitive-coupling vertical interconnects in 3D network-on-chip
Proceedings of the International Conference on Computer-Aided Design
Data bus swizzling in TSV-based three-dimensional integrated circuits
Microelectronics Journal
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In a general case of three-dimensional (3D) Integrated Circuit (IC) technology, it is desirable to design a die for 3D integration with flexibility to facilitate integration with a number of other circuit dies. We present a generic circuit technique which minimizes power consumption and circuit area while allowing reliable signal transfer between 3D dies as well as enabling the design of a bonded interface circuitry without a complete knowledge of inter-strata connection configurations. We also present parasitic RC characteristics of inter-strata connection elements, such as micro-bumps and through-substrate vias, and discuss the technology scaling trends. An inter-strata signal transmission, according to our method, has receive and transmit circuitry with programmable power supply which can be independently controlled for achieving optimum power and signal drive. In addition, the receive circuitry includes hysteresis to allow superior signal integrity in the presence of inter-strata parasitic variations.