Layout-aware gate duplication and buffer insertion

  • Authors:
  • D. Bañeres;J. Cortadella;M. Kishinevsky

  • Affiliations:
  • Universitat Politècnica de Catalunya, Barcelona, Spain;Universitat Politècnica de Catalunya, Barcelona, Spain;Strategic CAD Lab, Intel Corp., Hillsboro, OR

  • Venue:
  • Proceedings of the conference on Design, automation and test in Europe
  • Year:
  • 2007

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Abstract

An approach for layout-aware interconnect optimization is presented. It is based on the combination of three sub-problems into the same framework: gate duplication, buffer insertion and placement. Different techniques to control the combinatorial explosion are proposed. The experimental results show tangible benefits in delay that endorse the suitability of integrating the three sub-problems in the same framework. The results also corroborate the increasing relevance of interconnect optimization in future semiconductor technologies.