On switch factor based analysis of coupled RC interconnects
Proceedings of the 37th Annual Design Automation Conference
A bus delay reduction technique considering crosstalk
DATE '00 Proceedings of the conference on Design, automation and test in Europe
Interconnect Optimization Strategies for High-Performance VLSI Designs
VLSID '99 Proceedings of the 12th International Conference on VLSI Design - 'VLSI for the Information Appliance'
Optimal shielding/spacing metrics for low power design
ISVLSI '03 Proceedings of the IEEE Computer Society Annual Symposium on VLSI (ISVLSI'03)
Design and CAD Challenges in sub-90nm CMOS Technologies
Proceedings of the 2003 IEEE/ACM international conference on Computer-aided design
A Skewed Repeater Bus Architecture for On-Chip Energy Reduction in Microprocessors
ICCD '05 Proceedings of the 2005 International Conference on Computer Design
Design and analysis of spatial encoding circuits for peak power reduction in on-chip buses
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
A dual-VDD boosted pulsed bus technique for low power and low leakage operation
Proceedings of the 2006 international symposium on Low power electronics and design
A robust edge encoding technique for energy-efficient multi-cycle interconnect
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
Proceedings of the 21st International conference on Real-Time Networks and Systems
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In this paper, we propose a new edge encoding technique to reduce the energy consumption in multi-cycle interconnects. Both average and worst-case energy are reduced by desynchronizing the edges of rising and falling transitions. In a 1.2V 65nm CMOS technology, the approach achieves up to 31% energy reduction with no latency overhead over optimally designed conventional busses due to coupling capacitance reductions. The technique further reduces energy consumption by 38% with iso-throughput at the expense of one-cycle latency. Energy savings are shown to be more robust to process variations than previous techniques.