AsAP: A Fine-Grained Many-Core Platform for DSP Applications

  • Authors:
  • Bevan Baas;Zhiyi Yu;Michael Meeuwsen;Omar Sattari;Ryan Apperson;Eric Work;Jeremy Webb;Michael Lai;Tinoosh Mohsenin;Dean Truong;Jason Cheung

  • Affiliations:
  • University of California, Davis;University of California, Davis;University of California, Davis;University of California, Davis;University of California, Davis;University of California, Davis;University of California, Davis;University of California, Davis;University of California, Davis;University of California, Davis;University of California, Davis

  • Venue:
  • IEEE Micro
  • Year:
  • 2007

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Abstract

Many emerging and future applications require significant levels of complex digital signal processing and operate within limited power budgets. Moreover, dramatically rising VLSI fabrication and design costs make programmable and reconfigurable solutions increasingly attractive. The AsAP project addresses these challenges with a chip multiprocessor composed of simple processors with small memories, achieving high energy efficiency and throughput in a small chip area.