Application-specific MPSoC reliability optimization

Authors:
Zhenyu Gu;Changyun Zhu;Li Shang;Robert P. Dick
Affiliations:
Synplicity Inc., Sunnyvale, CA;Electrical and Computer Engineering Department, Queen's University, Kingston, ON, Canada;Electrical and Computer Engineering Department, University of Colorado at Boulder, Boulder, CO;Electrical Engineering and Computer Science Department, Northwestern University, Evanston, IL
Venue:
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
Year:
2008

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Abstract

This paper presents modeling and estimation techniques permitting the temperature-aware optimization of application-specific multiprocessor system-on-chip (MPSoC) reliability. Technology scaling and increasing power densities make MPSoC lifetime reliability problems more severe. MPSoC reliability strongly depends on system-level MPSoC architecture, redundancy, and thermal profile during operation. We propose an efficient temperature-aware MPSoC reliability analysis and prediction technique that enables MPSoC reliability optimization via redundancy and temperature-aware design planning. Reliability, performance, and area are concurrently optimized. Simulation results indicate that the proposed approach has the potential to substantially improve MPSoC system mean time to failure with small area overhead.