A Comparative Study of Two Boolean Formulations of FPGA Detailed Routing Constraints
IEEE Transactions on Computers
Design methodology for IC manufacturability based on regular logic-bricks
Proceedings of the 42nd annual Design Automation Conference
A metal and via maskset programmable VLSI design methodology using PLAs
Proceedings of the 2004 IEEE/ACM International conference on Computer-aided design
OPC-free and minimally irregular IC design style
Proceedings of the 44th annual Design Automation Conference
Optimal Layout of CMOS Functional Arrays
IEEE Transactions on Computers
Transistor-level layout of high-density regular circuits
Proceedings of the 2009 international symposium on Physical design
A new FPGA detailed routing approach via search-based Boolean satisfiability
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
sub-SAT: a formulation for relaxed Boolean satisfiability with applications in routing
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
On old and new routing problems
Proceedings of the 2011 international symposium on Physical design
Can pin access limit the footprint scaling?
Proceedings of the 49th Annual Design Automation Conference
Designing VeSFET-based ICs with CMOS-oriented EDA infrastructure
Proceedings of the 2013 ACM international symposium on International symposium on physical design
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In this paper, we describe an automatic place and route strategy for a high-density, super-regular, double-gate, transistor-array-based layout. Interconnects on all metal layers are strictly parallel and can be manufactured by an optical proximity correction free process. Our objective is to achieve a circuit layout area equal to the transistor footprint. Such layout constraints limit routing flexibility and render traditional approaches impractical. Our tools automatically generate circuits with several tens of transistors. Experimental results demonstrate both the efficiency of the proposed algorithms and the high quality of the layouts produced.