DIVA: a reliable substrate for deep submicron microarchitecture design
Proceedings of the 32nd annual ACM/IEEE international symposium on Microarchitecture
Route packets, not wires: on-chip inteconnection networks
Proceedings of the 38th annual Design Automation Conference
Information leakage from optical emanations
ACM Transactions on Information and System Security (TISSEC)
CRYPTO '99 Proceedings of the 19th Annual International Cryptology Conference on Advances in Cryptology
FPL '99 Proceedings of the 9th International Workshop on Field-Programmable Logic and Applications
What Will Have the Greatest Impact in 2010: The Processor, the Memory, or the Interconnect?
HPCA '02 Proceedings of the 8th International Symposium on High-Performance Computer Architecture
Lattice Scheduling and Covert Channels
SP '92 Proceedings of the 1992 IEEE Symposium on Security and Privacy
IEEE Spectrum
Secure program execution via dynamic information flow tracking
ASPLOS XI Proceedings of the 11th international conference on Architectural support for programming languages and operating systems
Minos: Control Data Attack Prevention Orthogonal to Memory Model
Proceedings of the 37th annual IEEE/ACM International Symposium on Microarchitecture
ReVirt: enabling intrusion analysis through virtual-machine logging and replay
OSDI '02 Proceedings of the 5th symposium on Operating systems design and implementationCopyright restrictions prevent ACM from being able to make the PDFs for this conference available for downloading
Thermal analysis of a 3D die-stacked high-performance microprocessor
GLSVLSI '06 Proceedings of the 16th ACM Great Lakes symposium on VLSI
Proceedings of the 12th international conference on Architectural support for programming languages and operating systems
Die Stacking (3D) Microarchitecture
Proceedings of the 39th Annual IEEE/ACM International Symposium on Microarchitecture
A novel dimensionally-decomposed router for on-chip communication in 3D architectures
Proceedings of the 34th annual international symposium on Computer architecture
Copilot - a coprocessor-based kernel runtime integrity monitor
SSYM'04 Proceedings of the 13th conference on USENIX Security Symposium - Volume 13
Physical unclonable functions for device authentication and secret key generation
Proceedings of the 44th annual Design Automation Conference
Micro-Architectural Cryptanalysis
IEEE Security and Privacy
3D-Stacked Memory Architectures for Multi-core Processors
ISCA '08 Proceedings of the 35th Annual International Symposium on Computer Architecture
A system architecture for reconfigurable trusted platforms
Proceedings of the conference on Design, automation and test in Europe
BitBlaze: A New Approach to Computer Security via Binary Analysis
ICISS '08 Proceedings of the 4th International Conference on Information Systems Security
A Survey of Hardware Trojan Taxonomy and Detection
IEEE Design & Test
Hardware assistance for trustworthy systems through 3-D integration
Proceedings of the 26th Annual Computer Security Applications Conference
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3-D circuit-level integration is a chip fabrication technique in which two or more dies are stacked and combined into a single circuit through the use of vertical electroconductive posts. Since the dies may be manufactured separately, 3-D circuit integration offers the option of enhancing a commodity processor with a variety of security functions. This paper examines the 3-D design approach and provides an analysis concluding that the commodity die system need not be independently trustworthy for the system of joined dies to provide certain trustworthy functions. In addition to describing the range of possible security enhancements (such as cryptographic services), we describe the ways in which multiple-die subsystems can depend on each other, and a set of processing abstractions and general design constraints with examples to address these dependencies.