An efficient approach to multi-layer layer assignment with application to via minimization

  • Authors:
  • Chin-Chih Chang;Jason Cong

  • Affiliations:
  • Department of Computer Science, University of California, Los Angeles, CA;Department of Computer Science, University of California, Los Angeles, CA

  • Venue:
  • DAC '97 Proceedings of the 34th annual Design Automation Conference
  • Year:
  • 1997

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Abstract

In this paper, we present an efficient heuristic algorithmfor the layer assignment and via minimization problem formulti-layer gridless IC, PCB, and MCM layout.We introducethe notion of the extended conflict-continuation (ECC)graph to represent the multi-layer layer assignment problem.Our algorithm is based on a linear time optimal algorithmthat solves a special case of the layer assignment problemwhen the ECC graph is a tree.For the general layer assignmentconstructs a sequence of induced subtrees in theECC graph and applies our linear time optimal algorithmto each of the induced subtrees.We have applied this algorithmto the via minimization problem and get very encouragingresults.We have achieved 13%-16% via reduction onthe routing layout generated by V4R router, which is arouter known to have low usage of vias.We successfully appliedour algorithm to routing examples of over 30,000 wiresegments and over 40,000 vias.